Thermally enhanced electronic package

ABSTRACT

A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.

CROSS REFERENCE TO RELATED APPLICATIONS

This Nonprovisional application claims priority under 35 U.S.C. §119(e)of U.S. Provisional Application No. 61/354,927, filed Jun. 15, 2010, andU.S. Non-Provisional application Ser. No. 12/948,964, filed Nov. 18,2010, the entire contents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a thermally enhanced electronicpackage, and more particularly, to an electronic package with highthermal dissipation capability.

2. Description of the Related Art

Continued demand for improved performance of semiconductor productsresults in greater operating frequencies and greater power consumption.Therefore, electrical packages having high thermal conductivity capableof effective heat dissipation to reduce the interconnect junctiontemperature are needed for such products. One example is a type ofsemiconductor device called a liquid crystal display (LCD) driver.

A typical LCD driver package is illustrated in FIG. 1. The LCD driverpackage 10 comprises a driver chip 11 and a tape carrier 14. The tapecarrier 14 includes a polyimide (PI) substrate 143, a wiring layer (orcopper foil) 142 formed on the substrate 143, and a resistant (soldermask) 141 overlaying the wiring layer 142. The driver chip 11 is mountedon the tape carrier 14 by flip-chip bonding. The bumps 13 formed on theactive surface of the driver chip 11 are connected to the wiring layer142 of the tape carrier 14. An insulator (or resin) 12 is filled in thegap between the driver chip 11 and a tape carrier 14 to protect thebumps 13 and the inner leads of the wiring layer 142.

Larger LCD television panel size and higher operating refresh ratedemand high power/high density LCD drivers. Therefore, a heat sink isneeded to lower the temperature of the LCD driver in a chip on film(COF) package, preferably below 70□. Accordingly, FIGS. 2A to 2E showseveral typical LCD driver packages equipped with heat sinks.

As shown in FIG. 2A, the LCD driver package 20 comprises a driver chip11 and a film carrier 24. The film carrier 24 includes a PI substrate243, a wiring layer 242 formed on the substrate 243, and a resistant 241overlaying the wiring layer 242. A first heat sink 251 is attached tothe passive surface of the driver chip 11, and a second heat sink 252 isadhered to the substrate 243 by a thermal adhesive 26. To improve thethermal dissipation, conductive columns 244 connect the wiring layer 242and the adhesive 26 through the substrate 243.

By contrast, the second heat sink 252 of the LCD driver package 20′ isdirectly attached to the substrate 243, as shown in FIG. 2B. Comparedwith the configuration shown in FIG. 2A, the LCD driver package 2 a inFIG. 2C also has two heat sinks (251, 252), but the second heat sink 252is not underneath the driver chip 11. The layout of the wiring layer242′ of the film carrier 24′ is different from that of the film carrier24. The second heat sink 252 is adhered to the substrate 243 by theadhesive 26.

The LCD driver package 2 b in FIG. 2D has only the second heat sink 252which is directly attached to the substrate 243. The second heat sink252′ of the LCD driver package 2 c in FIG. 2E is underneath the driverchip 11, and has an opening 253 aligned with the driver chip 11.

Considering the aforesaid conventional LCD driver packages, a commonthermal dissipation method is to use a thermally conductive adhesiveloaded with high percentage (by weight) of fillers to attach a sheet ofaluminum film as a heat sink to the film side of the COF package.However, as an exposed surface of the aluminum heat sink needs to befurther electrically insulated, an additional organic polymer film 37with low thermal conductivity such as a polyimide film is repeatedlyadhered on a surface of the second heat sink 252 of the COF (chip onfilm) package 30, as shown in FIG. 3. The organic polymer film 37 isattached to the second heat sink 252 by an additional adhesive 36.

The multilayer configuration makes the thermal management of the packagevery inefficient. In addition, the conventional thermal conductiveadhesive depends on direct physical contact of filler particles for heatconducting. This requires high filler loading to ensure good contactbetween particles which makes the heat transfer very inefficient andsensitive to the surrounding temperature. Moreover, using aforesaidaluminum film as a heat sink, the bending capability of COF packageswill become limited. Therefore, to remedy the conventional drawbacks,novel materials and methods are needed to improve the thermalperformance of the package.

SUMMARY OF THE INVENTION

An aspect of the present invention is to provide a thermally enhancedelectronic package. A dielectric resin material mixed with carbonnanocapsules

(CNC) is used in the electronic packaging to improve thermaldissipation. As the CNC transfers and dissipates heat into infraredenergy through absorption and radiation, the CNC mixed material iseffective for thermal dissipation and is thus capable of reducing theoperating temperature of the electronic package.

In view of the above, the present invention discloses a thermallyenhanced electronic package which comprises a driver chip, an insulator,a flexible carrier, and carbon nanocapsules. The flexible carrierincludes a flexible substrate, a wiring layer formed on the substrate,and a resistant overlaying the wiring layer. The driver chip isconnected to the wiring layer. The insulator is filled in the gapbetween the driver chip and the flexible carrier. The dielectric resinmixed with carbon nanocapsules can be disposed on the driver chip, onthe resistant, or on the flexible carrier. Alternatively, the carbonnanocapsules can also be disposed and mixed in the insulator.

The present invention further discloses a thermally enhanced electronicpackage which comprises a driver chip, an insulator, a flexible carrier,carbon nanocapsules, and at least one heat sink. The flexible carrierincludes a flexible substrate, a wiring layer formed on the substrate,and a resistant overlaying the wiring layer. The heat sink is attachedto the driver chip or the flexible carrier. The driver chip is connectedto the wiring layer. The insulator is filled in the gap between thedriver chip and the flexible carrier. The carbon nanocapsules aredisposed on the driver chip, on the resistant, on the flexible carrier,in the insulator, or on the heat sink.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described according to the appended drawings inwhich:

FIG. 1 is a cross-sectional diagram of a conventional LCD driverpackage;

FIGS. 2A to 2E are cross-sectional diagrams of conventional LCD driverpackages equipped with various formats of heat sinks;

FIG. 3 is a cross-sectional diagram of a conventional LCD driver packageequipped with an aluminum film as a heat sink;

FIG. 4A shows an imaging system for capturing IR images of an LCD driverpackage;

FIGS. 4B to 4E show the IR images of the LCD driver package captured inFIG. 4A;

FIG. 4F shows another imaging system to capture IR images of an LCDdriver package;

FIGS. 4G to 4L show the IR images of the LCD driver package captured inFIG. 4F in which the driver chip (silicon chip) 11, the PI substrate143, the insulator 12, the wiring layer 142 and the resistant 141 areall transparent to infrared radiation. The driver chip 11 of the LCDdriver package 10 in FIG. 4F directly faces the IR light, but the PIsubstrate 143 of the LCD driver package 10 in FIG. 4A directly faces theIR light;

FIGS. 5A to 5C show cross-section diagrams of LCD driver packages inaccordance with the present invention;

FIGS. 6A to 6B show cross-section diagrams of LCD driver packages inaccordance with the present invention;

FIGS. 7A to 7G show cross-section diagrams of LCD driver packages withheat sinks in accordance with the present invention;

FIGS. 8A to 8C shows the combination of a heat sink and a tape carrierin accordance with the present invention;

FIGS. 9A-9E show an LCD driver package mounted on an LCD panel inaccordance with the present invention; and

FIG. 10 shows a top view of a LCD driver package in accordance withpresent invention.

PREFERRED EMBODIMENT OF THE PRESENT INVENTION

The invention relates to the application of carbon nanocapsules tosemiconductor packages having enhanced thermal dissipationcharacteristics. In particular, a dielectric material or resin isblended with a small quantity of carbon nanocapsules for use inelectronic packaging applications with the purpose of improving heatdissipation of semiconductor chips. Such a mixed material or resin isdirectly or indirectly in contact with semiconductor chips to improveheat transfer and dissipation. The applications of the mixed material tothe semiconductor packages include flip chip underfill, non-flowunderfill, chip encapsulant, chip coating, die-attach adhesives,non-conductive paste/film, conductive paste/film, film-on-wire, etc.

Carbon nanocapsules have the characteristic of effectively transformingheat into infrared radiation through absorption and radiation which isthe primary way for heat removal from the electrical packages. Thesecarbon nanocapsule surfaces are further processed to ensure they areelectrically insulated to prevent parasitic effects or electrical shortin applications and may be optionally functionalized to achieve goodinterfacial adhesion between the nanocapsule particles and the baseresins so that CNC can evenly be dispersed in the base resins.

A carbon nanocapsule is a polyhedral carbon cluster constituted ofconcentric multi-layers of closed graphitic sheet structures. Thediameter of a carbon nanocapsule is between approximately 1 and 100 nmwhere the average diameter is 30 nm There are two types of carbonnanocapsules: hollow and metal-filled. The center of a hollow carbonnanocapsule is a nanoscale cavity, while that of a metal-fillednanocapsule is filled with metals, metal oxides, metal carbides, oralloys.

Carbon nanocapsules were first discovered in 1991, in the process ofproducing carbon nanotubes. Due to the strong Van der Waals forcebetween carbon nanocapsules and carbon nanotubes, it is not easy toisolate carbon nanocapsules from carbon nanotubes. In addition, thequantity of carbon nanocapsules produced with carbon nanotubes issufficient only for structural observation under an electron microscope,thus the application thereof is limited.

With continuous research, processes producing high-purity hollow carbonnanocapsules as well as magnetic metal-filled carbon nanocapsules havebeen developed. Please further refer to U.S. Pat. No. 7,156,958, andPat. No. 6,872,236. In addition to the chemical properties of carbon,with the special hyperfullerene structure and optoelectronic propertiesof carbon nanocapsules, a carbon nanocapsule thin film should beelectrically and thermally conductive, anti-oxidizing, and asstructurally stable as graphite; thus it is suitable for applicationssuch as an electrically and thermally conductive film, achemical-resistive and anti-oxidizing protective film, a carbonelectrode of an ultra-thin lithium battery and others.

A dielectric resin material when mixed with carbon nanocapsules issuitable for use in electronic packaging to effectively remove heat. Asthe carbon nanocapsule is capable of transferring heat into infraredenergy by absorption and radiation, the material is effective for heatdissipation and thus is capable of reducing the operating temperature ofthe electronic package. Examples of nanocapsules are shown in U.S. Pat.No. 6,841,509, U.S. Patent Application 20060008404, and US PatentApplication 20040126303. The resin material mixed with carbonnanocapsules transfer heat not only by conduction but also by radiation,so the capability of the heat dissipation of the material is effectivelyimproved. That is, the electronic package employing the mixed resinmaterial has better heat-dissipation capability.

Carbon nanocapsule surfaces as described above are processed to make thecarbon nanocapsules substantially electrically insulated by formingelectric insulating layers. Referring to U.S. Patent publication No.20080287591, the carbon nanocapsule surface may also optionally befunctionalized to achieve good interfacial adhesion between nanocapsuleparticles and the resins.

As it is known that silicon material is transparent to infraredradiation, a mixture of carbon nanocapsules and resin is effective fortransferring thermal energy through the body of silicon-basedsemiconductors. FIG. 4A shows an imaging system to capture IR images ofan LCD driver package. FIGS. 4B to 4E show the IR images of the LCDdriver package captured in FIG. 4A in which the driver chip (siliconchip) 11, the PI substrate 143, the insulator 12, the wiring layer 142and the resistant 141 are all transparent to infrared radiation. IRlights a1-d1 are incident on the LCD driver package 10 placed on a stage41. The lights a1-d1 are radiated on and reflected from the wiring layer142, the stage 41, the active surface of the driver chip 11, and thebumps 13 to be the reflected lights a2-d2 radiating towards a CCD camera42. The CCD camera 42 can capture the images of the LCD driver package10. Please note the directions of the reflected lights a1-d1, a2-d2shown in FIG. 4A are illustrative only.

FIG. 4B shows the complete image of an LCD driver package, and FIG. 4Cshows the enlarged image of the portion M in FIG. 4B. FIG. 4D also showsthe enlarged image of the portion N in FIG. 4C, and the Applicant's logoon the driver chip 11 can clearly be seen. FIG. 4E shows the enlargedimage of the portion O in FIG. 4D, and the images of the parts (a3, c3,d3) formed by the reflected lights (a2, c2, d2) clearly demonstrate thespecified configurations including inner leads, the applicant's logo,and bumps, respectively.

FIG. 4F shows another imaging system to capture IR images of an LCDdriver package. FIGS. 4G to 4L show the IR images of the LCD driverpackage captured in FIG. 4F in which the driver chip (silicon chip) 11,the PI substrate 143, the insulator 12, the wiring layer 142 and theresistant 141 are all transparent to infrared radiation. The driver chip11 of the LCD driver package 10 in FIG. 4F directly faces the IR light,but the PI substrate 143 of the LCD driver package 10 in FIG. 4Adirectly faces the IR light.

IR light a4-d4 are incident on the LCD driver package 10 placed on astage 41.

The lights a4-d4 are radiated on and reflected from the wiring layer142, the stage 41, the active surface of the driver chip 11, and thebumps 13 to be the reflected lights a5-d5 radiating towards a CCD camera42. The CCD camera 42 can capture the images of the LCD driver package10.

FIG. 4G shows the complete image of an LCD driver package, and FIG. 4Hshows the enlarged image of the portion W in FIG. 4G. FIG. 41 also showsthe enlarged image of the portion X in FIG. 4H, and the Applicant's logoon the driver chip 11 can be seen. FIG. 4J shows the enlarged image ofthe portion Y in FIG. 4D. FIG. 4J shows the enlarged image of theportion Z in FIG. 4D, and the parts (a6, c6, d6) of the images formed bythe reflecting lights (a5, c5, d5) clearly demonstrate the specifiedconfigurations including the inner leads 142, the applicant's logo, andbumps 13, respectively.

Therefore, the aforesaid mixture is suitable for use in direct contactwith a functional silicon die in a semiconductor package. Compared tothe usage of conventional heat conduction and convention forsemiconductor package heat dissipation, additional paths of transferringheat using infrared radiation through the body of silicon chips makethermal energy removal much more efficient. Materials for suchapplications include encapsulant, flip-chip underfill, and coatings. Theabove mixture is also suitable for various die attach adhesiveapplications for use in attaching a die onto a substrate (rigid orflexible) or for die stacking. These adhesives include products commonlyknown in the field such as screen-on die attach paste, die attach film(DAF), film over wire (FOW) and non-conducting paste (NCP).

FIG. 5A shows a cross-section diagram of a LCD driver package inaccordance with the present invention. The LCD driver package 50comprises a driver chip 51 and a tape carrier 54. Moreover, the tapecarrier 54 includes a polyimide (PI) substrate 543, a wiring layer (orcopper foil) 542 formed on the substrate 543, and a resistant (soldermask) 541 overlaying the wiring layer 542. The driver chip 51 is mountedon the tape carrier 54 by flip-chip bonding. The bumps 53 formed on thedriver chip 51 are connected to the wiring layer 542 of the tape carrier54. An insulator (or resin) 52 is filled with the gap between the driverchip 51 and a tape carrier 54 to protect the bumps 53 and inner leads ofthe wiring layer 542.

Carbon nanocapsules 55 are evenly mixed in the insulator 52, so the heatgenerated from the driver chip 51 can be effectively transferred by thecarbon nanocapsules 55 in a thermal radiation manner. Furthermore, thecarbon nanocapsules 55evenly mixed in an adhesive 58 are also coated onthe substrate 543.

Compared with the LCD driver package 50 in FIG. 5A, the carbonnanocapsules 55 are not mixed in the insulator 52 of the LCD driverpackage 50′ in FIG. 5B, but are also evenly mixed in the adhesive 58 andcoated on the PI substrate 543. Heat is acceleratively emitted along thearrows towards the environments because the carbon nanocapsules 55 helpto remove the heat accumulated in the PI substrate 543.

As shown in FIG. 5C, the carbon nanocapsules 55 mixed in the adhesive 58are further coated on the upper surfaces of the driver chip 51 (apassive surface of the driver chip 51), the insulator 52, the resistant541, and the wiring layer 542. So, the heat generated from the driverchip 51 can be further transferred to the side of the PI substrate 543in an infrared radiation way.

FIG. 6A shows an LCD driver package 60 having resin 62 mixed with carbonnanocapsules between the driver chip 51 and the tape carrier 54 so theheat generated from the driver chip 51 acceleratively emitted along thearrows towards the environments. FIG. 6B shows an LCD driver package 60′having resin 62 mixed with carbon nanocapsules and a coating layer 63with carbon nanocapsules on the PI substrate 543 so the heat generatedfrom the driver chip 51 acceleratively emitted along the upward anddownward arrows towards the environments.

FIGS. 7A-7C show cross-section diagrams of LCD driver packages with heatsinks in accordance with the present invention. The LCD driver package70 further comprises a first heat sink 551 and a second heat sink 552.The first heat sink 551 is attached to the passive surface of the driverchip 51, and the second heat sink 552 is adhered to the substrate 543 bythermally conductive adhesive 56. To improve the thermal dissipation, afirst coating layer 571 with carbon nanocapsules overlays the uppersurfaces of the first heat sink 551, the insulator 62, the resistant541, and the wiring layer 542, and a second coating layer 572 withcarbon nanocapsules overlays the surfaces of the PI substrate 543 andthe second heat sink 552. So, the heat generated from the driver chip 51is acceleratively emitted upwards and downwards towards theenvironments.

By contrast, the second heat sink 552 of the LCD driver package 70′ isdirectly attached to the substrate 543, as shown in FIG. 7B. Comparedwith FIG.

7A, the LCD driver package 7 a in FIG. 7C also has two heat sinks (551,552), but the second heat sink 552 is not underneath the driver chip 51.To improve the thermal dissipation, conductive columns 544 connect thewiring layer 542 and the adhesive 56 through the substrate 543 of thetape carrier 54′. A first coating layer 571 with carbon nanocapsules anda second coating layer 572 with carbon nanocapsules respectively coverthe upper surface and the lower surface of the LCD driver package 7 a.

The LCD driver package 7 b in FIG. 7D has only the second heat sink 552which is directly attached to the substrate 543. Compared with FIG. 7C,the adhesive 56′ mixed with carbon nanocapsules can further improve thethermal dissipation of the LCD driver package 7 c in FIG. 7E. As shownin FIG. 7F, the second heat sink 552 of the LCD driver package 7 d isdirectly attached to the substrate 543. To improve the thermaldissipation, conductive columns 544 connect the wiring layer 542 throughthe substrate 543 of the tape carrier 54′.

The second heat sink 552′ of the LCD driver package 7 e in FIG. 7G isunderneath the driver chip 51, and has an opening 553 aligned with thedriver chip 51.

The second heat sink (552 or 552′) can be directly formed by etchingwhole copper foil on the PI substrate 543, or is a prefabricated pieceand attached to the PI substrate 543.

FIG. 8A shows the combination of a heat sink and a tape carrier inaccordance with the present invention. The heat sink 852 has an opening853 and a plurality of slots 854 along the transversal direction of thefilm 843. The heat sink 852 is adhered to the film 843. The slots 854can help the heat sink 852 to be bent. Similarly, the heat sink 852′ inFIG. 8B also has an opening 853 and a plurality of slots 854′ along thelengthwise direction of the film 843. The heat sink 852″ in FIG. 8C hasthree slots 854″ aligned in a line along the transversal direction ofthe film 843.

Each of FIGS. 9A-9E shows an LCD driver package mounted on an LCD panelin accordance with the present invention. One side of the LCD driverpackage 90 is connected to the TFT substrate 911 of the LCD panel 91,and another side of the LCD driver package 90 is connected to a drivingPCB 92. The LCD panel 91 further comprises a filter substrate 912disposed on the TFT substrate 911. The first coating layer 571 of carbonnanocapsules and the second coating layer 572 of carbon nanocapsulescover the LCD driver package 90 so the heat generated from the driverchip 51 is acceleratively emitted outwards towards the environments.Furthermore, the resin 62 with carbon nanocapsules directly contacts thedriver chip 51, and can transfer the heat to the first coating layer 571and the second coating layer 572.

Similarly, the LCD driver package 90′ in FIG. 9B further comprises thefirst heat sink 551 adhered to the driver chip 51 and the second heatsink 552 adhered to the PI substrate 543 by the adhesive 56. So, theheat can be effectively transferred to the second coating layer 572through the second heat sink 552, the conductive columns 544, and thewiring layer 542.

As shown in FIG. 9C, the LCD driver package 9 a comprises a second heatsink 952 adhered to the PI substrate 543. The second heat sink 952 hastwo slots 954. The second heat sink 952′ of the LCD driver package 9 bin FIG. 9D further has an opening 953. By contrast, the second heat sink952″ of the LCD driver package 9 c in FIG. 9E has an opening 953 and aslot 954.

FIG. 10 shows a top view of a LCD driver package in accordance withpresent invention. The first coating layer 571 of carbon nanocapsulescovers the top surface of the LCD driver package 100.

The above descriptions of the present invention are intended to beillustrative only. Numerous alternative methods may be devised bypersons skilled in the art without departing from the scope of thefollowing claims.

What is claimed is:
 1. A thermally enhanced electronic package,comprising: a flexible carrier including: a flexible substrate; a wiringlayer formed on the substrate; and a resistant overlaying the wiringlayer; a driver chip connected to the wiring layer; an insulatordisposed between the driver chip and the flexible carrier; a first heatsink attached to the driver chip; and carbon nanocapsules disposed onthe driver chip, on the resistant, on the flexible carrier, in theinsulator, or on the first heat sink, wherein the heat generated fromthe driver chip is transferred by the carbon nanocapsules in a thermalradiation manner toward an opposite side of the driver chip with respectto the flexible carrier, and the carbon nanocapsule surfaces areprocessed to form electric insulating layers to avoid electrical short.2. The thermally enhanced electronic package of claim 1, furthercomprising a second heat sink attached to the flexible substrate.
 3. Thethermally enhanced electronic package of claim 1, further comprising afirst coating layer overlaid on the first heat sink, wherein the carbonnanocapsules are evenly distributed in the first coating layer.
 4. Thethermally enhanced electronic package of claim 3, wherein the firstcoating layer is overlaid on the insulator and the resistant.
 5. Thethermally enhanced electronic package of claim 2, further comprising asecond coating layer overlaid on the second heat sink and the flexiblesubstrate, wherein the carbon nanocapsules are evenly distributed in thesecond coating layer.
 6. The thermally enhanced electronic package ofclaim 1, wherein the carbon nanocapsules are evenly distributed in theinsulator.
 7. The thermally enhanced electronic package of claim 7,further comprising an adhesive, wherein the second heat sink is attachedto the flexible substrate by the adhesive.
 8. The thermally enhancedelectronic package of claim 7, wherein the carbon nanocapsules areevenly distributed in the adhesive.
 9. The thermally enhanced electronicpackage of claim 2, wherein the second heat sink includes at least oneslot.
 10. The thermally enhanced electronic package of claim 2, furthercomprising at least one conductive column connecting the wiring layerand the second heat sink.
 11. A thermally enhanced electronic package,comprising: a flexible carrier including: a flexible substrate; a wiringlayer formed on the substrate; and a resistant overlaying the wiringlayer; a driver chip connected to the wiring layer; an insulatordisposed between the driver chip and the flexible carrier; a first heatsink attached to the flexible substrate; and carbon nanocapsulesdisposed on the driver chip, on the resistant, on the flexible carrier,in the insulator, or on the first heat sink, wherein the heat generatedfrom the driver chip is transferred by the carbon nanocapsules in athermal radiation manner toward an opposite side of the driver chip withrespect to the flexible carrier, and the carbon nanocapsule surfaces areprocessed to form electric insulating layers to avoid electrical short.12. The thermally enhanced electronic package of claim 11, furthercomprising a second heat sink attached to the driver chip.
 13. Thethermally enhanced electronic package of claim 11, further comprising afirst coating layer overlaid on the first heat sink, wherein the carbonnanocapsules are evenly distributed in the first coating layer.
 14. Thethermally enhanced electronic package of claim 13, wherein the firstcoating layer is overlaid on the flexible substrate.
 15. The thermallyenhanced electronic package of claim 12, further comprising a secondcoating layer overlaid on the second heat sink, wherein the carbonnanocapsules are evenly distributed in the second coating layer.
 16. Thethermally enhanced electronic package of claim 11, wherein the carbonnanocapsules are evenly distributed in the insulator.
 17. The thermallyenhanced electronic package of claim 11, further comprising an adhesive,wherein the first heat sink is attached to the flexible substrate by theadhesive.
 18. The thermally enhanced electronic package of claim 17,wherein the carbon nanocapsules are evenly distributed in the adhesive.19. The thermally enhanced electronic package of claim 11, wherein thefirst heat sink includes at least one slot.
 20. The thermally enhancedelectronic package of claim 11, further comprising at least oneconductive column connecting the wiring layer and the first heat sink.